. SF<0 11> Dopping: undoped, Conducting type: P type. Polish: Two side EPI ready polished Resistivity: N A Mobility: 600 700cm^2 Vs Carrier concentration: (1 3)x10^17 ohm. cm EPD : <2000 cm^ 2 Packing: 1000 class clean room in a single wafer container Surface finish (RMS or Ra) : < 5A Dopant Type Carrier Concentration ( cm 3) Mobility ( cm2 V. Sec)"> . SF<0 11> Dopping: undoped, Conducting type: P type. Polish: Two side EPI ready polished Resistivity: N A Mobility: 600 700cm^2 Vs Carrier concentration: (1 3)x10^17 ohm. cm EPD : <2000 cm^ 2 Packing: 1000 class clean room in a single wafer container Surface finish (RMS or Ra) : < 5A Dopant Type Carrier Concentration ( cm 3) Mobility ( cm2 V. Sec)"> . SF<0 11> Dopping: undoped, Conducting type: P type. Polish: Two side EPI ready polished Resistivity: N A Mobility: 600 700cm^2 Vs Carrier concentration: (1 3)x10^17 ohm. cm EPD : <2000 cm^ 2 Packing: 1000 class clean room in a single wafer container Surface finish (RMS or Ra) : < 5A Dopant Type Carrier Concentration ( cm 3) Mobility ( cm2 V. Sec)"> GaSb Wafer (111)-B, undoped,P-type 2"x0.5 mm ,2sp Anode 004mm) (Inside) (Melting Point: ~660ºC) – constructoracolonial.com.ar

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GaSb Wafer (111)-B, undoped,P-type 2"x0.5 mm ,2sp Anode 004mm) (Inside) (Melting Point: ~660ºC)

$459.43

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004mm)  (Inside)     (Melting Point:  ~660ºC)

Two electrode feed-throughs are inserted inside the vessel to measure battery properties

Compressed Gas and Force

The tube adaptor is made of high purity alumina fiber board and is designed for OTF-1200X Split Tube Furnace to accpet  2" OD processing tube

(Optional) The vacuum pump and fittings are not included

GaSb Wafer (111)-B, undoped,P-type 2"x0.5 mm ,2sp Anode 004mm) (Inside) (Melting Point: ~660ºC)Wafer Specifications:. Size: 2" diameter x 0. 5 mm, Orientation: (111) B Flats: SEMI PF <01 1>. SF<0 11> Dopping: undoped, Conducting type: P type. Polish: Two side EPI ready polished Resistivity: N A Mobility: 600 700cm^2 Vs Carrier concentration: (1 3)x10^17 ohm. cm EPD : <2000 cm^ 2 Packing: 1000 class clean room in a single wafer container Surface finish (RMS or Ra) : < 5A Dopant Type Carrier Concentration ( cm 3) Mobility ( cm2 V. Sec)

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