G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title close year

close year

the user estimates all biases and variances associated with the equipment being compared under the specified operating conditions and with respect to the process characteristic(s) of interest

Topic & Readings

2-0316 (Reapproved 0124)

SEMI 3D7-0913 (first published)

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title close yearThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.