E16600 - SEMI E166 - Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard StdPbc-0321 the requirements are presented as

the requirements are presented as a guideline

on the other hand

SECS-II) are added as adjunct standards

and C from the as-received surface

features as small as 20 nm (peak to valley) can result in post CMP discoloration of dielectrics as a result of local thickness variation of the remaining dielectric

E16600 - SEMI E166 - Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard StdPbc-0321 the requirements are presented asThe purpose of this Standard is to ensure minimum necessary level of physical connectivity between the transport module and process modules comprising the cluster tool for 450 mm. It is expected that a process module can be connected to the transport module of any cluster tool with least design change provided that both modules meet the requirement of this Standard. Process modules accept wafers at locations that may vary substantially from one module