G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications Silicon (Si) wafers for PV

Silicon (Si) wafers for PV applications cut from a Si ingot or Si brick by multiple-wire sawing contain artifacts characteristic for this cutting process

The purpose of identifying and classifying training tiers is to provide the basis for a common understanding of the knowledge

which provides a unified standard for the manufacture

but it is not expected to be material dependent

SEMI E10-86 (first published)

G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications Silicon (Si) wafers for PVMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of