M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn The heat sink mounting method

The heat sink mounting method for measuring junction-to-case thermal resistance will be a conservative measure of the package’s ability to transfer heat to the ambient environment because heat sinking is provided only on one side of the package

7 125mm鏡面研磨単結晶シリコンウェーハ（セカンダリフラットあり）

however the definitions used are subject to interpretation

orgで，そして2009年3月にCD-ROMで入手可能となる。初版は2002年11月に発行された。

which provides uniform illumination of the specimen

M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn The heat sink mounting methodThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007. Originally published in 1992; previously published March 2003. NOTICE: This document was balloted and approved for withdrawal in 2007. Dielectrically isolated (DI) wafers are used for fabricating specialized