F02000 - SEMI F20 - Specification for 316L Stainless Steel Bar, Forgings, Extruded Shapes, Plate, and Tubing for Components Used in General Purpose, High Purity and Ultra-High Purity Semiconductor Manufacturing Applications StdPbc-0213 3 — Standard Mechanical Interface

3 — Standard Mechanical Interface (SMIF)

3  Wafer thinning technology becomes popular to meet the demand for thin packages

and transient electric and electromagnetic fields

SEMI G93-0412 (first published)

org in March 2018

F02000 - SEMI F20 - Specification for 316L Stainless Steel Bar, Forgings, Extruded Shapes, Plate, and Tubing for Components Used in General Purpose, High Purity and Ultra-High Purity Semiconductor Manufacturing Applications StdPbc-0213 3 — Standard Mechanical InterfaceThe purpose of this Specification is to define the metallurgical cleanliness requirements and material composition of 316L stainless steel required for use in the manufacture of components for general purpose, high purity, and ultra high purity chemical (gas or liquid) distribution systems. This Specification defines the requirements for 316L stainless steel bar, forgings, and extruded shapes as specified in ASTM A276, ASTM A182, JIS G 4303, and JIS G