US$ 123.00
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M8-93 (technical revision)
$115.50
Description
SEMI M8-93 (technical revision)
higher-level injection is often adopted
Thermal equipment
used to ship
2) ribbon and back electrode
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI M8-93 (technical revision)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
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