G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdTpc-Lead Finishes SEMI 3D11-1214 (Reapproved 0420)

SEMI 3D11-1214 (Reapproved 0420)

This document covers requirements for dichlorosilane (SiH2Cl2) used in the semiconductor industry

originally used for indicating optical direction of the films

The XML Messaging Specification uses established

SEMI D62-0619 (technical revision)

G01500 - SEMI G15 - Standard Test Method for Differential Scanning Calorimetry of Molding Compounds StdTpc-Lead Finishes SEMI 3D11-1214 (Reapproved 0420)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document describes procedures for evaluating epoxy molding compounds by differential scanning calorimetry (DSC). This test method uses SI units. Referenced SEMI Standards (purchase separately) None. Revision History